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August 09, 2022 | 16:28

Samsung to produce Flip-chip Ball Grid Array in Vietnam

Phan Anh

Samsung Electronics will produce the Flip-chip Ball Grid Array at Samsung Electro-Mechanics Viet Nam (SEMV) in northern Thai Nguyen province from July 2023. The announcement was made by Mr. Roh Tae-Moon, CEO of Samsung Electronics, when he met with Prime Minister Pham Minh Chinh on August 5.

Samsung to produce Flip-chip Ball Grid Array in Vietnam
Mr. Roh Tae-Moon, CEO of Samsung Electronics, meets with Prime Minister Pham Minh Chinh on August 5. Source: VGP

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The original article is written and published on VnEconomy in Vietnamese, then translated into English by Askonomy – an AI platform developed by Vietnam Economic Times/VnEconomy – and published on En-VnEconomy. To read the full article, please use the Google Translate tool below to translate the content into your preferred language.
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